MSCI/
Deposition methods, structure, properties, applications and failure mechanisms of thin solid films. Includes sputtering, plating, evaporation and chemical vapor deposition of crystalline and amorphous metals, semiconductors and insulators. Applications are primarily in microelectronics, data storage, micro-electro-mechanical systems, wear & corrosion prevention and thermal barriers.
Topics
Physical
vapor deposition: Evaporation of
various metals, semiconductors and dielectrics. Sputtering of Ti and TiN for
adhesion, plating seed layers, diffusion barrier layers and corrosion
resistance. Sputtering of amorphous WSi2
for IC gate electrodes.
Chemical
vapor deposition: WSi2, W and Si for electrical
interconnect. Silicon nitride for
capacitors, electrical isolation, oxidation block layer, memory cells,
antifuses and protective overcoat. Silicon
oxide doped with B and/or P for electrical isolation, planarization, and mobile
ion control. Epitaxy for producing a
lightly-doped or highly stressed layer on a single-crystal substrate.
Thermal/mechanical
deposition: Spin-on coatings such as
glass and polymers for IC planarization, isolation and protective overcoat;
magnetic/optical films for data storage disks; and anti-reflective
coatings. High-purity oxide films for
MOS semiconductor gate dielectric.
Aqueous
deposition: Electroplated Cu for
integrated circuit (IC) damascene interconnect.
Electroless Ni-P plating for wear and corrosion resistance, the first
metallic glass.
Film
characterization: Measurement of
basic properties: thickness, sheet resistance, weight gain, reflectivity,
stress, roughness, hardness, and yield strength. Capacitance-voltage (CV) testing of
metal-oxide-semiconductor structures.
Analysis of composition and structure by secondary ion mass spectroscopy
(SIMS),
Other
topics: Use of thin films as sensors: resistive
temperature sensors, strain gauges, magnetic disk read/write heads, chemical
analysis. Patterning of films
(photolithography).
Optional Supplemental
VLSI
Technology 2nd Edition by S. M. Sze, McGraw Hill 1988 ...Covers of all aspects of
integrated circuit technology, and about half is devoted to thin film
processing and materials issues. Excellent book, but out of print.
Silicon Processing for the VLSI Era - Volume 1 - Process Technology by S. Wolf and R. Tauber, Lattice Press, 1986
...Excellent, comprehensive discussion of the many diverse processing
techniques and materials used in integrated circuits. Covers much of the same
material as the Sze book but in more detail.
Great book, but no problems are provided and it costs about $230
new. Includes one especially useful
chapter concerning design of experiments.
A copy (of the 2000 edition) is on reserve at Fondren Library.
An
Introduction to Physics and Technology of Thin Films by A. Wagendristel and Y. Wang, World Scientific
Publishing Co., 1994 ...Covers much of the same material as the Ohring text. A
good value at $42. Lots of information condensed into 147 pages, but difficult
to read at times.
Physics
of Thin Films 2nd edition by L. Eckertova, Plenum Press,
1986 … Covers much of the same material as the Ohring text but costs 20% more
and is getting a bit out-of-date in some areas.
Electrical
Conduction in Solids by D.
Pollock, American Society for Metals, 1985 ...Includes in one chapter a
detailed discussion of electrical resistivity in pure substances and alloys and
the temperature coefficient of resistivity, with application to determination
of phase equilibria, control of precipitation during heat treatment,
order/disorder and allotropic transformations, clustering, effects of
deformation, strain gauges and thermometry.
Handbook of
Sputter Deposition Technology by
K. Wasa and S. Hayakawa, Noyes Publications, 1992 ...among other helpful
information, Table 1.1 summarizes a wide variety of size (thickness) effects in
thin films.
Handbook of
Physical Vapor Deposition (PVD) Processing by Donald M. Mattox, Noyes Publications, 1998.
...includes preparation of substrates, vacuum equipment, plasmas, deposition
equipment, film nucleation and growth, process control, film characterization,
film adhesion, as well as mentioning alternatives to PVD. Very thorough.
The
Chemistry of Metal CVD edited by
T. Kodas and M. Hampden-Smith, VCH Publishers, 1994. ...While focusing in
detail on the CVD of Al, W, Cu, Au, Ag, Pt, Pd & Ni for integrated circuit
applications, the book also touches on 21 other pure metals and several
stoichiometric compounds which can be deposited by CVD and some which are
problematic and can't be deposited by CVD. Applications other than integrated
circuits are considered only briefly.
Metals
Handbook 9th ed. by ASM Handbook
Committee, especially: Volume 5: Surface Cleaning, Finishing and Coating; Volume 8: Metallography and Microstructures; and Volume
10: Materials Characterization. ... Metals Handbook is a great resource
for materials scientists, metallurgists, chemists, and crystallographers.
Optical Properties
of Thin Solid Films by O.
Heavens,
Resources On the Web
MEMS Devices:
NOTICE
Any student with a disability requiring
accommodations in this course is encouraged to contact Instructor after class
or by phone and also Disability Support Services in the