Elec 422: VLSI Design I

Fall 2003

Notes on Final Layout and Submission to MOSIS.

MOSIS AMI 0.5u Process

In order to prepare for chip fabrication, you will need to provide the following data:

1 Project Description

MOSIS requests a one-paragraph description of your project. Please limit the description to approximately 50 words and e-mail it to cavallar@rice.edu. Please add this to your project web homepage. Also, please give your project a name, which is less than 8 characters long, (for example, vending, for a vending machine project). MOSIS only tracks project names that are less than 8 characters.

2 I/O Pads

Please follow the notes on the I/O pad frames and your experience in HW4 and HW5. Explicit bonding diagrams to relate your magic padframe to physical pins on the packages will be provided.

3 CIF File Creation

Again, follow the notes on CIF file creation to make sure that there are no DRC errors.

CIF puts a “top dummy” cell into the hierarchy when you read CIF back into magic.

Be sure to check that cell and also the cell one below in the hierarchy which is your actual final cell.

4 Final CIF Location

Please send e-mail indicating the location of the final CIF file, (publicly readable) called “submit.cif” in the above example. Please do not mail the file, since it will be quite large. Please make sure that the file and directory are publicly readable.

5 Additional Materials

In order to facilitate the testing of the fabricated chips in Elec 423, please prepare a pin description in your report. Please label the signals on the padframe sheet, which was handed out, and include this in your report. You may wish to redraw the diagram. Also indicate the purpose of each pin, (for example, “b0: First data input bit” and whether it is an input, output, or bidirectional. Indicate the controlling signal, if the pin is bidirectional. Summarize this information in a file called “project.io” which should be formatted as follows:

i b0

i b1

i b2

i bipin0

i RESET

o result0

o result1

o bipin0

Each signal is on a new line, where the first character indicates whether the signal is an input or an output. (Note that if the pin is bi-directional, then it appears as both an input and an output.) Use the labels that are in your final .sim file. Please e-mail this file to cavallar@rice.edu.

6 Final Irsim

A final irsim simulation should be performed from the pads. Paint some metal over the pad in the top level cell, and label appropriately. You make wish to call a signal “data1” internally and “p_data1” at the I/O pad.

Please create a directory for the final irsim simulation that contains the .sim file, the .cmd files, and Postscript files of the simulation results. Please e-mail the location of this publicly readable directory to cavallar@rice.edu. Please choose a set of test vectors that will show the basic functionality of the chip.

7 Some Final Checks

When you have your final cif file and final corrected and read-back-in magic database, it is good to check the following details:

• Verify Vdd and GND connectivity. Use the ”s” select key in magic to highlight ”in white” all the connected Vdd lines. This will visually verify that your routing is complete.

• Make sure that the Vdd strap in the PLA is connected.

• Be careful about extractor warnings and warnings from ext2sim. Please track done, document, and eliminate those warnings. Do the same for GND, clka, and clkb. Please justify any unresolved warnings. Let me say this again… Please check all extractor and ext2sim warnings. Many times these do truly indicate sections of Vdd or GND or clka or clkb that are not connected. You may need to look in the .sim file to see if there are two separate nets for each of these signals.

• Please verify that the PLA description does not contain any same state loops. That is, if you need a delay counter embedded in a PLA, then the meg file should have an explicit state for each state of the count. We have had reliability problems if you stay in the same state but output PLA signals and then read those same PLA outputs as inputs for the next evaluation cycle.

• If you are using mpla to produce Decoders or ROM as described in the note on the Elec422 web page, then note that the 0.5 micron technology, the PLA template has problems with the 3 lambda poly spacing. To work-around this issue, please add input and output clocks to the decoder and then tie clka and clkb to Vdd to allow the clocks to pass through. So then, mpla should be invoked as mpla –I –O -s SCS3cisnew decode.mpla Note that this workaround is only for the Decoders or ROMs. Use the regular platool_subm for normal state machine controllers.

• When simulating from the 0.5 micron I/O pads, please use a piece of Metal1 to place your label on the I/O pad, just inside of the large square bonding pad region near the “Tanner and MOSIS” logos. Also please leave the label called “hack” which allows the extractor to better understand the resistor in the I/O pad.

• Note that the 0.5 micron I/O pad labels are different than in the other documentation, so “OEN” is “ENABLE”, “DO” is “OUT”, “DATA” is “IN_unbuffered”, “DIB” is “INbar”, and “DI” is “IN”.

• Please verify that there are no Design Rule Errors and that all well and substrate contact issues have been fixed.

• Be careful about substrate contacts of the wrong polarity. Again select the Vdd net. Then in magic a :what command. This will show all layers and labels connected to Vdd. Among the layers, you should see “nsubstratecontact”. If you see also “psubstratecontact” listed, then there is a major problem and a potential short. Use the same technique to verify that only ”psubstratecontact” is connected to GND. The output of :what will be several screens worth of data. Make sure that your Unix shell terminal window can capture it all; you may need to update your Xwindow settings.

• Be careful about the MOSIS minimum density rules which 15% for poly and 30% for metal1 and metal2 layers. Please use the Perl scripts described in the recent handout.

• Be careful about any logos that produce design rule errors. These must be fixed so that the material is a valid shape.

8 Fabrication Status

Once the CIF file has been accepted by MOSIS and queued for fabrication, I will post the fabrication status reports on the class web page. Good luck.